UPG 80 CNC-2C
The UPG 80 CNC-2C is ideal for fine and ultra-precision grinding of optical surfaces and brittle-hard materials. With minimal subsurface damage, it significantly reduces polishing effort and time while ensuring excellent form accuracy. Precise axis guidance, a vibration-dampened design, and high-quality spindle bearings guarantee outstanding surface form and quality. Typical applications include semiconductor, SiC processing, aerospace, laser optics, and precision optics.
Óptica de precisión
CNC
Grinding
Solicitud de contacto
Aspectos destacados
- 4-axis ultra-precision grinding machine for fine and ultra-fine grinding of optical surfaces and workpieces made of brittle-hard materials
- Two grinding spindles and one workpiece spindle for flexible machining strategies and the use of various grinding processes
- Machine base made of granite for maximum rigidity, excellent vibration damping and thermal stability
- Rolling bearing mounted fine grinding spindle and hydrostatically mounted ultra-fine grinding spindle for superior surface quality and process reliability
- Hydrostatic guidance in all linear and rotary axes ensures excellent and smooth running, free from wear and maximum positioning accuracy
- Outstanding surface form accuracy and extremely low surface roughness
- Capability for pre-grinding, fine grinding, and ultra-fine grinding with peripheral grinding wheels in a single machine
- Integrated dressing cycle for consistent machining quality and minimized downtime
- Depending on the process, ultra-precision grinding can already deliver surfaces suitable for interferometric measurement
- Geometries and workpieces: Spheres, aspheres, freeform surfaces, cylindrical surfaces (A-toric, aspheric) and other components made of hard and brittle materials
- Typical applications: Semiconductor technology, silicon carbide machining, aerospace and astrotechnology, laser optics manufacturing, and precision optics production
Ventaja del sistema
- Precise axis guidance, vibration-dampened machine design and high-quality spindle bearings
- Excellent surface form accuracy and low surface roughness
- Extremely low subsurface damage (<6 µm), resulting in significantly reduced polishing times while maintaining high shape retention
- Minimal polishing removal rates due to low subsurface damage
- Optimized process times with maximum dimensional and form accuracy
Características del proceso
- Spherical Optics:
Diameter 10–80 mm, maximum workpiece height 65 mm. Form grinding with peripheral grinding wheels. (depending on tool diameter) - Aspherical Optics:
Diameter 10–80 mm, maximum workpiece height 30–60 mm. Form grinding in single-point mode with peripheral grinding wheels. (depending on tool diameter) - Machining Modes: Raster or spiral grinding with peripheral grinding wheels. (4D Spiral Mode as an option)
Opciones
- Required Accessories: Hydraulic unit for spindles, 4-circuit heat exchanger, chiller unit, coolant tank
- Available workpiece holders and clamping systems options: HD25 precision cementing pieces, HD25 vacuum holders, HD25 collets
- Spindle configuration: 2 hydrostatic tool spindles
- Measuring probe for workpiece (for center thickness and position)
- Measuring probe for tool
- SR 80 automatic loading system
