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SMP 801 CNC

CNC-controlled plano grinding machine SMP 801 CNC with KombiTool Technology for cut to polish quality and optional second tool spindle for finest processing (3C–Technology).

Óptica de precisión
CNC
Grinding
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Aspectos destacados

  • Two step processing in one work cycle with the KombiTool / KombiTool+ [link] (combined rough and fine grinding tool) 
  • Optional third processing step using diamond pellet tool or diamond foil tool (3C-Technology, requires second Z-Axis)
  • Precise plano surfacing to polishable quality due to optimised grinding parameters with multi-cut technology, adjusted speed and feed rates for all spindles 
  • New drive concepts with highly dynamic digital drives for all axes
  • Microsoft Windows operating system with OptoTech user interface, graphically controlled, ensuring shorter set-up times
  • Design according to current EMV- and CE-requirements

Ventaja del sistema

  • High precision surface generation
  • Optimized machining parameters for cut-to-polish grinding
  • 3C-Technology Option for even better surface qualities and up to 30-50% shorter polishing cycle times 

Opciones

  • 2nd Tool Spindle with integrated 2nd Z-Axis for 3C Technology (TwinCut-Version)
  • Vacuum Table, Magnetic Table, Combined Vacuum and Magnetic Table
  • OptoTech KombiTool and Plano Finest Grinding Tool
  • Hydro Expansion Clamping Technology for standard plano tools
SMP 801 CNC
Working Range Diameter0 mm - 800 mm
Clamping TechnologyVacuum Table or Magnetic Table
Tool SpindlesSpeed: 0 - 2850 rpm; Interface: Flange
Workpiece SpindleSpeed: 0 - 250 rpm; Interface: Flange
Vacuum-0.6 bar
Air Pressure Requirement6 bar
Power Requirement (others on request)37 kW
DimensionsWidth: 2600 mm, Height: 2850 mm, Depth: 2800 mm
Weight (approx.)8000 kg